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Hitachi GroupProducts & Services
Hitachi GroupCorporate Information
Hitachi Kyowa manufactures optical sub-assemblies (silicon platforms with anisotropic-etched v-grooves and upside pyramidal cavities used for passive alignment of bulk optics/fiber) and Heat sinks.
The heat sink materials range in thermal conductivity from about 35W/m·K (Al2O3) up to 270W/m·K (SiC), hence our heat sinks are capable of dissipating heat according to the power consumption of a specific optical device. By selecting a suitable substrate material, it is possible to reduce thermal strain during device assembly. Various types of solder which allow for efficient die bonding are available.
Hitachi High Technologies America is Hitachi's sales and marketing representative for North America.
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